ECR Sputter Feed development at NSCL (abstract only)

D.Cole; G.Machicoane; L.Tobos; P.Zavodszky

Chinese Physics C> 2007, Vol. 31> Issue(S1) : 239-239

ECR Sputter Feed development at NSCL (abstract only)

National Superconducting Cyclotron Laboratory, Michigan State University, East Lansing, MI 48824, USA

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Abstract：
Production of metallic ion beams in support of the experimental program at the Coupled Cyclotron Facility at the NSCL required the development of ion sputtering feed of metallic molybdenum, nickel, uranium, and zirconium for use with the ARTEMIS ion source. The production of high intensity lower to medium charge state ions required high material consumption, posing some significant difficulties in reliable long term beam stability. Resultant and ongoing hardware and technique developments to resolve these difficulties will be presented in this poster along with interesting effects of the ion source solenoid field polarity on the sputtering process.

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D.Cole, G.Machicoane, L.Tobos and P.Zavodszky. ECR Sputter Feed development at NSCL (abstract only)[J]. Chinese Physics C, 2007, 31(S1): 239-239.

D.Cole, G.Machicoane, L.Tobos and P.Zavodszky. ECR Sputter Feed development at NSCL (abstract only)[J]. Chinese Physics C, 2007, 31(S1): 239-239. shu

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Received: 2007-05-30
Revised: 1900-01-01

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沈阳化工大学材料科学与工程学院沈阳 110142

ECR Sputter Feed development at NSCL (abstract only)

Corresponding author: D.Cole,

National Superconducting Cyclotron Laboratory, Michigan State University, East Lansing, MI 48824, USA

Received Date: 2007-05-30
Accepted Date: 1900-01-01
Available Online: 2007-01-03

Abstract: Production of metallic ion beams in support of the experimental program at the Coupled Cyclotron Facility at the NSCL required the development of ion sputtering feed of metallic molybdenum, nickel, uranium, and zirconium for use with the ARTEMIS ion source. The production of high intensity lower to medium charge state ions required high material consumption, posing some significant difficulties in reliable long term beam stability. Resultant and ongoing hardware and technique developments to resolve these difficulties will be presented in this poster along with interesting effects of the ion source solenoid field polarity on the sputtering process.