RF thermal and new cold part design studies on a TTF-Ⅲ input coupler for Project-X

[1]
Project X Research Design Development Plan. Version2.2, 2009. 32 Solyak N. Power Couplers for ILC and Project X. DOESRF Review, 2009. 53 Solyak N, Yakovlev V. Project X Coupler Requirements.Project X Collaboration Meeting, FNAL, 2008. 114 Moeller W. High Power Coupler for the TESLA Test Facil-ity. Proc. of the 9th Workshop on RF Superconductivity.Santa Fe, USA, 1999. 577-5815 Dohlus M, Kostin D, Moeller W. TESLA RF Power Cou-pler Thermal Calculations. Proc. of LINAC 2004. Lubeck,Germany, 2004. 174-1766 ANSYS is a trademark of SAS Inc., (www.ansys.com)7 Li Z, Akcelik V, Candel A et al. Towards Simulation of Elec-tromagnetics and Beam Physics at the Petascale. Proc. ofPAC07. Albuquerque, New Mexico, USA, 2007. 889-8938 Somersalo E, Yla-Oijala P. Analysis of Multipacting inCoaxial Lines. Proc. of PAC95. Dallas, Texas, USA, 1995.1500-15029 Ge L, Adolphsen C, Ko K et al. Multipacting Simulationsof TTF-0 Power Coupler Components. Proc. of PAC07.Albuquerque, New Mexico, USA, 2007. 2436-243810 Veshcherevich V, Belomestnykn S, Quigley P et al. HighPower Tests of Input Couplers for Cornell ERL Injector.Proc. of SRF Workshop 2007. Beijing, China, 2007. 517-519